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microchip

mifb3BG
sundstrom
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microchip: A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som
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A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som
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bond, bonding, capsule, cavity, circuit, circuits, close, closeup, die, digital, IC, macro, magnified, micro, microelectronics, packagef, silicon, texture, wire, wires
microchip: A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som
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Image properties
Dimensions: 2345px * 2331px
Published: February - 16 - 2010
Camera: Nikon
Date: 2007:05:19 10:02:11
Aperture:f/10.0
Exposure: 10/150
Focal length: 1050/10
ISO: 1600
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microchip: A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som microchip: A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som microchip: A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som microchip: A digital application-specific integrated circuit, a research-chip developed at Lund University Sweden in the late 90's to be used for improving performance of mobile phone equipment transmitter power amplifiers. The silicon die in the middle measures som 300px //b.rgbimg.com/users/s/su/sundstrom/600/mifb3BG.jpg 600px //b.rgbimg.com/users/s/su/sundstrom/600/mifb3BG.jpg 100px